Jiaxing Huang is an associate professor of materials science and engineering at Northwestern University. His research interests are in material chemistry, processing, and manufacturing. Huang has been honored with the IUPAC Young Chemists Prize, an NSF CAREER Award, an Alfred P. Sloan Research Fellowship, and the Outstanding Young Manufacturing Engineer Award from the Society of Manufacturing Engineers. He received his B.S. degree in chemical physics from the University of Science and Technology of China (USTC) in 2000 and his Ph.D. in chemistry from the University of California, Los Angeles (UCLA), in 2004. Huang then became a Miller Research Fellow at the University of California, Berkeley, before joining Northwestern in 2007.
Associate Professor in School of Advanced Materials Science & Engineering
Dr. Sang-Woo Kim is now Associate Professor in School of Advanced Materials Science & Engineering and SKKU Advanced Institute of Nanotechnology (SAINT), and SKKU Young Fellow at Sungkyunkwan University (SKKU). He received his Ph.D from Kyoto University in Department of Electronic Science and Engineering in 2004. Prof. Kim pioneered the realization of large-scale transparent flexible
JaeJong Lee received the BS in precision machine engineering fron Chonbuk National University in 1985, a MS in production engineering from Korea Advanced Institute of Science & Technology(KAIST) in Seoul in 1987, and Ph.D in Mechanical Engineering from Korea Advanced Institute of Science &
Technology(KAIST) in DaeJeon in 1998. Since 1987 he has been working at the Korea Institute of Machinery and Materials(KIMM) in DaeJeon, Korea.
He is currently the Team Leader of the Nanomechanism Team of KIMM. He has been involved in developing nanoimprinting lithography equipment for large size wafer in CNMM which is one of the 21st century frontier program supported by Ministry of Science and Technology in Korea for exploring an emerging cutting-edge technology. He has research interests in the thermal and UV nanoimprinting lithography process and equipment technologies, and also SEM and e-beam lithography process and equipment technology for 3D functional device and sensors.